Plasma Etching Masina ka jɔcogo

ICP minɛnw bɛ kɛ yɔrɔ naani ye kosɛbɛ: pre-vacuum so, etching so, gazi sɔrɔcogo ani vacuum system.

(1) Sani-vacuum ka so

Pre-vacuum chamber ka baara ye ka a jira ko etching chamber ka mara vacuum hakɛ sigilen na, a kana nɔ bila kɛnɛma sigida la (i n’a fɔ buguri, ji la), ani ka gazi faratilenw bɔ so saniyalen na. A bɛ Kɛ ni datugulan ye, manipule (manipulateur), 'transmission mechanism (cikan-minɛn), isolation da, a ɲɔgɔnnaw.

(2) Etching so kɔnɔ

Etching chamber ye ICP etching minɛnw kɔnɔko jɔnjɔn ye. A bɛ nɔ tilennen bila etching rate la, etching jɔlen na, ani a roughness la. Etching chamber yɔrɔ kolomaw ye : sanfɛ-elektɔri, ICP arajo-fɔkan-yɔrɔ, RF arajo-fɔkan-yɔrɔ, duguma-elektɔri-sitɛmu, funteni-kɔlɔsili-minɛn, a ɲɔgɔnnaw.

(3) Gazi sɔrɔcogo

Gazi sɔrɔcogo ye ka gazi suguya caman lase etching chamber ma, ani ka gazi bɔli hakɛ ni a bolicogo kɔlɔsi tigitigi degun ɲɛminɛbaga (PC) ani mass flow controller (MFC) fɛ. Gazi sɔrɔcogo ye gazi sɔrɔyɔrɔ buteli ye, gazi lase pipeline, control system, mixture unit, a ɲɔgɔnnaw.

(4) Sistɛmu min bɛ wele ko Vacuum System
Vacuum system fila bɛ yen, kelen ye pre-vacuum chamber ye, tɔ kelen ye etching chamber ye. Pre-vacuum chamber bɛ bɔ ni masin pɔnpe ye. Ni vacuum hakɛ min bɛ pre-vacuum chamber kɔnɔ, o sera hakɛ latigɛlen ma dɔrɔn, isolation da bɛ se ka da wuli walasa ka wafer wuli. Vacuum min bɛ etching chamber kɔnɔ, o bɛ sɔrɔ masin pɔnpe ni molekiyɔmu pɔnpe fɛ. Gazi minnu bɛ Bɔ o wale in na etching chamber kɔnɔ, olu fana bɛ Bɔ vacuum system fɛ.